概要
设备工程系统（Equipment Engineering System、EES）是为了能够最大限度的提高半导体、FPD产业的生产效率，支持工程师能够监控良率提高及设备问题点改善等事项，支持能够分析及改善功能的系统。这最终能够提高设备的效率OEE（Overall Equipment Effectiveness）及品质，能够对设备进行整合管理。EES也可以称为EEC（Equipment Engineering Capability），国际半导体标准协会SEMATECH、SELECT为EES开发有效的半导体生产应用程序及运用的解决方案提供意见和建议，并在很多半导体FAB运营使用。Miracom的EES Solution是基于原有的SECS/GEM/HSMS方式的数据收集上，以更高一层的基于SOA的EDA（Equipment Data Acquisition）为基础提供，严格遵守SEMI、SEMATECH的标准规格。
 
 
Equipment Engineering System
- Data Gathering using SECS/GEM/HSMS & EDA
- RMS (Recipe Management System)
- Parameter Management
- Equipment Health Monitoring
- Performance Measuring
- Maintenance Management
- Equipment SPC
- Alarm Management
- FDC (Fault Detection & Classification)
- APC (Advanced Parameter Control)
- Unscheduled Downtime Reduction
- Wafer to Wafer Process Matching
- Equipment to Equipment Matching
- NPW Management Reduction
 
 
解决方案
Miracom为了从原材料投入到生产、出库为止的整个过程实现自动化及系统化，提供综合的解决方案和服务。Miracom在高新技术产业实施过多数大型项目并且确保专业的咨询团队，对于追求新的变化的客户提供接触疑问点、导出优质成果的专业咨询服务。
 
专业用词说明
- ERP: Enterprise Resource Planning
- SCM: Supply Chain Management
- CRM: Customer Relationship Management
- BPMS: Business Process Management System
- MES: Manufacturing Executing System
- YMS: Yield Management System
- EAP: Equipment Automation Process
- ICS: Inline Control System
- FDC: Fault Detection & Classification
- APC: Advanced Parameter Control
- RMS: Recipe Management System
- PMS: Preventive Maintenance System
- ARAMS: Automated Reliability Availability and Maintainability Standard System
- VM: Virtual Equipment
- PPM: Predictive / Preventive Maintenance
- RaP: Recipe and Parameter